ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,596, issued on Feb. 3, was assigned to Southworth Milton Inc. (Milford, Mass.). "Hydraulic tool stand" was invented by David Earle (Baldwins... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,588, issued on Feb. 3, was assigned to ROLLS-ROYCE plc (London). "Propulsion machine comprising a sealing module" was invented by Jack F Col... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. D1,110,709, issued on Feb. 3, was assigned to TUMI INC. (Edison, N.J.). "Backpack" was invented by Victor G. Sanz (Whitehouse Station, N.J.) and Pe... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,434, issued on Feb. 3, was assigned to ZEDEL (Crolles, France). "Energy absorber and method for manufacturing such" was invented by Victor P... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,587, issued on Feb. 3, was assigned to QUALCOMM Inc. (San Diego). "Periodic channel state information (CSI) measurement gap for bandwidth li... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,950, issued on Feb. 3, was assigned to MISSIONS SYSTEMS HOLDINGS PTY LTD. (Sydney). "Device and method for disabling an undersea mine, an un... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,091, issued on Feb. 3, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "MEMS mirror device and distance measuring apparatus" was invented... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. D1,111,082, issued on Feb. 3, was assigned to Shenzhen Kuhangxin Technology Co. LTD (Shenzhen, China). "Digital camera" was invented by JiaBin Li (... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,659, issued on Feb. 3, was assigned to DISCMA AG (Hunenberg, Switzerland). "Heating oven and method of use" was invented by Edward Seidl (La... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,343, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and method fo... Read More